Copper-nickel based alloy

Alloys or metallic compositions – Copper base

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148432, 148434, 148435, 148436, 148442, 420479, 420480, 420481, 420482, 420485, 420486, 420487, 420489, 420490, 420493, 420499, 420587, C22C 900

Patent

active

054416965

ABSTRACT:
A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.

REFERENCES:
patent: 4732731 (1988-03-01), Asai et al.
patent: 5019185 (1991-05-01), Nakajima et al.
patent: 5028282 (1991-07-01), Kubozono et al.
Mohamed I. Ismail, et al., "Effect of Boron on Order-Disorder Transformation of Some Heat-Treated Cu-Ni-Zn-Mn Alloys", Journal Phys. Chem. Solids, vol. 43 (1982), pp. 1029-1032.
Chemical Abstracts, vol. 112, No. 14, No. 123610n, p. 303, Apr. 2, 1990, K. Nakajima, et al., "Copper Alloys For Semiconductor Devices And Processing Of These Alloys".

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