Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...
Reexamination Certificate
2007-01-30
2007-01-30
Klemanski, Helene (Department: 1755)
Compositions: coating or plastic
Coating or plastic compositions
Metal-depositing composition or substrate-sensitizing...
C106S001260
Reexamination Certificate
active
10750716
ABSTRACT:
Materials and methods are described for electroless deposition of copper molybdenum. An aqueous bath composition for the electroless deposition of copper molybdenum includes;a soluble source of copper ions,a soluble source of molybdenum ions, anda reducing agent comprising boron,wherein the composition is adapted to electrolessly produce a copper molybdenum deposit.
REFERENCES:
patent: 3650777 (1972-03-01), Schneble et al.
patent: 4150171 (1979-04-01), Feldstein
patent: 4209331 (1980-06-01), Kukanskis et al.
patent: 5203911 (1993-04-01), Sricharoenchaikit et al.
patent: 5306336 (1994-04-01), Martyak et al.
patent: 5674787 (1997-10-01), Zhao et al.
patent: 5695810 (1997-12-01), Dubin et al.
patent: 6908504 (2005-06-01), Chebiam et al.
patent: 2004/0038073 (2004-02-01), Chebiam et al.
patent: 2005/0147762 (2005-07-01), Dubin et al.
P.C. Andricacos, Damascene Copper Electroplating for Chip Interconnect, IBM J. .Res. Develop 42 (1998) 567-573, no month available.
Y. Shacham-Diamand, V. Dubin, and M. Angyal, Copper Electroless deposition for ULSI, Thin Solid Films, 262, (1995) 93-103, no month available.
Vashkjalis A., Demontaine Q. Study of Cu electroless deposition process using NaBH4 as a reducing agent, Lithuanian Academy of Sciences publication, series B, vol. 4(95), pp. 11-16, 1976, no month available.
Molenaar A., J. of the Electrochem. Soc., 1982 vol. 129, N 9, p. 1917-1921, no month available.
Shalkauskas M., Vashkjalis A. Electroless deposition of metals on plastics, L., J. Chemistry, 1985, pp. 95-113, no month available.
Tetsuya Ogura, M. Malcomson, Q. Fernando, Mechanism of Copper Deposition in Electroless plating, Langmuir 1990, 6, pp. 1709-1710, no month available.
F.P. Pearlstein and R.F.Weightman, Electroless Deposition of Silver Using Dimethylamine Borane, Plating, Feb. 1974, pp. 154-157.
Y. Shacham-Diamand, and V. Dubin, J. of Microelectronics Engineering, 33, pp. 47-58, 1997.
Yosi Shacham-Diamand and Sergey Lopatin, Journal of Microelectronics Engineering, vol. 37/38, pp. 77-88, 1997, no month available.
E. Gileadi, Electrode Kinetics, VCH Publishers, New York 1993, no month available.
E. Podlaha and D. Landolt, A Mathematical Model Describing the Electrodeposition of Ni-Mo Alloys, J.of the Electrochem. Soc., vol. 143, pp. 893-899, 1996, no month available.
E. Podlaha and D. Landolt, Molybdenum Alloys with Nickel, Cobalt and Iron, J. of the Electrocem. Soc. vol. 144, pp. 1672-1680, 1997, no month available.
E. Podlaha and D. Landolt, An Experimental Investigation of Ni-Mo Alloys, J. of the Electrochem. Soc., vol. 143, pp. 885-892, 1996, no month available.
Y.Shacham-Diamand and Y.Sverdlov, Electroless Cu alloys for ULSI applications, in Proceedings of the Advanced Metallization Conference 2001 (AMC 2001), p. 67-72, Montreal, Canada, Oct. 8-11, 2001.
Y.Shacham-Diamand, A.Inberg, Y.Sverdlov and N.Croitoru, Electroless Silver and Silver with Tungsten Thin Films for Microelectronics and Microelectromechanical System Applications, J.of the Electrochemical Society, 147 (9) 3345-3349, Jan. 2000.
K.M. Gorbunova, A.A. Nikiforova, G.A. Sadakov, V.P. Moiseev, M.V. Ivanov, “Physical-chemical origins of chemical cobalt deposition”, “Science” publication, Moscow, pp. 195-201, 1974, no month available.
F.Ajogin, M.Belenki, I.Gall, “Galvanotechnique”, “Metallurgy” publication, Moscow, pp. 170-178, 538-540, 1987, no month available.
Y.Shacham-Diamand, A.Inberg, Y.Sverdlov, V.Bogush, N.Croitoru, H.Moscovich, A.Freeman, Electroless process for micro-and nanoelectronics, J.Electrochimica Acta 48 (2003) 2987-2996, no month available.
Shacham-Diamand Yossi
Sverdlov Yelena
Abelman ,Frayne & Schwab
Klemanski Helene
Ramot At Tel Aviv University Ltd.
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