Copper interconnection structure and method of preparing same

Details Copper interconnection structure and method of preparing same Copper interconnection structure and method of preparing same

1994-03-11

1995-07-04

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174256, 174257, 174261, 174262, H05K 100

Patent

active

054302587

ABSTRACT:
A method of preparing a Cu interconnection structure includes the following steps in the sequence: (a) depositing a Cu layer on a substrate layer; (b) depositing an Al layer on said Cu layer; (c) heating said Al layer and said Cu layer at a temperature ranging from 300.degree. C. to 550.degree. C. so as to transform said Al layer into a layer of alloy consisting of Al and Cu; and (d) depositing an insulating layer containing SiO.sub.2 on the alloy layer. Oxidation of Cu is suppressed by the formation of Al.sub.2 O.sub.3 on the outer surface of the alloy layer. Therefore, increase of electrical resistance of the Cu interconnection structure is substantially suppressed.

REFERENCES:
patent: 3180022 (1965-04-01), Briggs
patent: 3306716 (1967-02-01), Adler
patent: 4109372 (1978-08-01), Geffken
patent: 4500898 (1985-02-01), Cline
patent: 4521476 (1985-06-01), Asai et al.
patent: 4910169 (1990-03-01), Hoshino
patent: 4917963 (1990-04-01), Kittler
patent: 4985750 (1991-01-01), Hoshino
"Cu Wiring Technology to LSI device", Semiconductor World, Jun. 1988, pp. 89-93.
Knuyt, "Electrical Resistivity Calculations for Amorphous Cu.sub.x Al.sub.1-x ", Phys. Stat. Sol (6) 123, (1984), pp. 763-771.

Affiliated with

Also associated with

Rating

Copper interconnection structure and method of preparing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper interconnection structure and method of preparing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper interconnection structure and method of preparing same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-761923