Copper grid for strain analysis of sheet metal deformation

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – Indicating coating or sheet providing direct visual indication

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G01B 530

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active

042928516

ABSTRACT:
An improved grid for computer-aided strain analysis of a deformed metal sheet comprises a preferred grid pattern of noncontacting uniform solid circles formed of thin plated copper and surrounded by exposed sheet surface. The copper circles are applied to the sheet surface and the sheet is deformed, whereupon the circles are stretched into ellipses. After sheet deformation, the ellipse pattern is oxidized to enhance contrast between the copper ellipses and the surrounding sheet metal and thereby enable the pattern to be reliably photographed for computer analysis.

REFERENCES:
patent: 3789657 (1974-02-01), Ching et al.
Ayres et al., "Grid Circle Analyzer-Computer Aided Measurement of Deformation,", SAE Technical Paper, No. 790741, Jun. 11, 1979.

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