Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor – Sheet – web – wire – or filament
Patent
1990-04-18
1992-12-15
Tufariello, T. M.
Electrolysis: processes, compositions used therein, and methods
Electroforming or composition therefor
Sheet, web, wire, or filament
428544, C25D 104
Patent
active
051714175
ABSTRACT:
Copper conductive foil for use in preparing printed circuit boards is electrodeposited from an electrolyte solution containing copper ions, sulphate ions and thiourea. The thiourea operates to decrease the roughness of the foil, to enable operation at higher current densities, and/or to modify the tensile strength and ductility characteristics of the foil. An IPC Class 2 foil is prepared without annealing.
REFERENCES:
patent: 2563360 (1951-08-01), Phillips et al.
patent: 3923109 (1966-12-01), Luce et al.
Ibl et al, Electrochimica Acta, 1972, vol. 17, pp. 733-739.
Knuutila, et al, "The Effect of Organic Additives on the Electrocrystallization of Copper", 1987, pp. 129-143.
Bucci, et al, "Foil Technology for PCB Fabrication: Foil Manufacturing & Developments for Advanced PCB Designs", presented at PCFAC Expo '86 (May 12, 1986).
Afifi, et al, Journal of Metals, Feb. 1987, pp. 38-41.
Franklin, Surface and Coating Technology, 30, (1987) pp. 415-428.
Chia, et al, Journal of Metals, Apr. 1987, pp. 42-45.
Clouser Sidney J.
DiFranco Dino F.
Gould Inc.
Tufariello T. M.
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