Copper-foiled laminated sheet for flexible printed circuit board

Details Copper-foiled laminated sheet for flexible printed circuit board Copper-foiled laminated sheet for flexible printed circuit board

1986-11-10

1989-02-21

Herbert, Thomas J.

Stock material or miscellaneous articles

Composite

Of metal

428458, 428901, B32B 1508, B32B 2736

Patent

active

048064327

ABSTRACT:
The copper-foiled laminated sheet of the invention is used to prepare a printed circuit sheet having see-throughness after patterning by etching of the copper foil. Different from conventional copper-foiled laminates using an electrolytic copper foil having a surface roughness of 10 or larger, the inventive laminate is prepared using a rolled copper foil having a surface roughness of 1.5 to 5 so that the surface of the adhesive layer, from which the copper foil has been removed by etching, has no undue roughness as a replica of the copper foil surface not to irregularly diffuse the light giving a parallel light-beam transmission of at least 50% and overall light transmission of at least 70% to ensure good see-through visibility.

REFERENCES:
patent: 3902951 (1975-09-01), Doi et al.
patent: 4559257 (1985-12-01), Nilsson
patent: 4647508 (1987-03-01), Mazit et al.

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