Copper foil with low profile bond enhancement

Details Copper foil with low profile bond enhancement Copper foil with low profile bond enhancement

2005-05-17

2005-05-17

LaVilla, Michael (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S626000, C428S607000, C428S612000, C428S674000, C428S336000

Reexamination Certificate

active

06893742

ABSTRACT:
A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and the entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte, and a release layer effective to facilitate separation of the metal foil layer from the carrier strip disposed between and contacting both the first side of the carrier strip and the second side of the metal foil layer.

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IPC, “Metal Foil for Printed Wiring Applications,” Metallic Foils Task Group Standard IPC-4562, 2/00, p.p.1-20. (Feb. 2000).

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