Copper foil having bond strength

Details Copper foil having bond strength Copper foil having bond strength

1974-06-10

1977-03-01

Rutledge, L. Dewayne

Metal working

Means to assemble or disassemble

Puller or pusher means, contained force multiplying operator

204 16, B32B 1520

Patent

active

040100057

ABSTRACT:
A copper foil having high bond strength with an insoluble particle-containing metal plate formed thereon, the plated copper foil being adapted for use in the preparation of, for example, a printed circuit.

REFERENCES:
patent: 3152972 (1964-10-01), Brown et al.
patent: 3152973 (1964-10-01), Tomaszewski et al.
patent: 3298802 (1967-01-01), Odekerken
patent: 3449223 (1969-06-01), Odekerken
patent: 3471271 (1969-10-01), Brown et al.
patent: 3585010 (1971-06-01), Luce et al.
patent: 3666636 (1972-05-01), Tomaszewski et al.
patent: 3753667 (1973-08-01), Metzger
patent: 3857681 (1974-12-01), Yates et al.

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