Copper-foil having a protective layer and copper-clad laminates

Details Copper-foil having a protective layer and copper-clad laminates Copper-foil having a protective layer and copper-clad laminates

1997-12-22

1999-07-06

Bueker, Richard

Etching a substrate: processes

Forming or treating electrical conductor article

216 95, 216100, 216105, 216106, 205 50, 428544, 428607, 428615, H01B 1300

Patent

active

059193794

ABSTRACT:
Copper foil having a matte surface and an opposite shiny surface, the shiny surface having thereon a protective metallic coating comprised of a first protective metallic layer, preferably iron, electrodeposited on the shiny surface and a second metallic layer, preferably zinc, electrodeposited on the first layer, the metallic coating be chemically removable without damage to the copper foil and the second metallic layer being softer than the first metallic layer. The matte surface of the copper foil can be bonded to a dielectric material, and the protective metallic coating can be removed from the shiny surface by etching.

REFERENCES:
patent: 3844857 (1974-10-01), Chiang
patent: 3936548 (1976-02-01), Konicek
patent: 4525240 (1985-06-01), Elias et al.
patent: 5366814 (1994-11-01), Yamanishi et al.
patent: 5403672 (1995-04-01), Urasaki et al.

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