Copper foil for the manufacture of printed circuit boards and me

Electrolysis: processes – compositions used therein – and methods – Product produced by electrolysis involving electrolytic...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

205 77, 205155, 205156, 205197, 205243, 205244, 205318, 205319, 427 96, 428607, 428612, 428658, 428674, 428687, C25D 104, C25D 706, B21C 3700

Patent

active

054476194

ABSTRACT:
A surface of copper foil is protected from oxidation and tarnishing by electrodepositing on the surface a protective layer containing metallic zinc and one or more compound of tri-valent chromium, which protection layer is easily removable by dissolution in a dilute aqueous alkaline solution and which preferably has a zinc to chromium weight ratio of 1:1 or greater. An electrodeposited copper foil especially suited for multilayer printed circuit boards has such a protective layer electrodeposited on the matte side thereof and an electrodeposited copper bonding treatment on the shiny side thereof.

REFERENCES:
patent: Re30180 (1979-12-01), Wolski et al.
patent: 2769774 (1956-11-01), Loveland et al.
patent: 3625844 (1969-06-01), McKean
patent: 3674656 (1972-07-01), Yates
patent: 3853716 (1974-12-01), Yates et al.
patent: 3857681 (1974-12-01), Yates et al.
patent: 3998601 (1976-12-01), Yates et al.
patent: 4572768 (1986-02-01), Wolski et al.
patent: 5207889 (1993-05-01), Wolski et al.
patent: 5215646 (1993-06-01), Wolski et al.
Grant and Hackh's Chemical Dictionary, 5th ed. (1987), p. 135.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Copper foil for the manufacture of printed circuit boards and me does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper foil for the manufacture of printed circuit boards and me, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper foil for the manufacture of printed circuit boards and me will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-470518

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.