Copper foil for printed-wiring board and copper-clad...

Details Copper foil for printed-wiring board and copper-clad... Copper foil for printed-wiring board and copper-clad...

2006-01-24

2006-01-24

Zimmerman, John J. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

C428S612000, C428S626000, C428S658000, C428S675000, C428S687000, C428S935000

Reexamination Certificate

active

06989199

ABSTRACT:
The object is to provide a copper foil excellent in the property of selective etching between a resistor layer and a copper layer required in production of a printed-wiring board, and also excellent in UL heat resistance. For this purpose, a copper foil for printed-wiring board comprising a nodular treatment side on one side, wherein a nickel-zinc alloy layer is formed on the nodular treatment side is used for applications of printed-wiring boards. At the same time, a production method suitable for production of the copper foil is provided.

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RD 194003 (Research Disclosure 194003) published Jun. 1980, 2 pages.

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