Copper foil for printed wiring board

Details Copper foil for printed wiring board Copper foil for printed wiring board

1996-03-11

1998-01-27

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

428623, 428632, 428626, 428658, 428675, 428935, B32B 1520

Patent

active

057120471

ABSTRACT:
A copper foil for a printed wiring board which has a carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic % of zinc and 0.1 to 20 atomic % of carbon is produced by dipping a copper foil in a non-cyanide copper-zinc electroplating bath containing a copper salt, a zinc salt, a hydroxycarboxylic acid or a salt thereof, an aliphatic dicarboxylic acid or a salt thereof and a thiocyanic acid or a salt thereof, and carrying out electrolysis in the non-cyanide copper-zinc electroplating bath using the copper foil as a cathode to form on at least one surface of the copper foil a carbon-containing copper-zinc coating.

REFERENCES:
patent: 4010005 (1977-03-01), Morisaki et al.
patent: 4356067 (1982-10-01), McCoy
patent: 4417956 (1983-11-01), McCoy
patent: 4537837 (1985-08-01), Gunn et al.
patent: 4961828 (1990-10-01), Lin et al.
patent: 5061550 (1991-10-01), Shimizu et al.
patent: 5356528 (1994-10-01), Fukuda et al.

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