Copper foil for printed circuit boards

Electrolysis: processes – compositions used therein – and methods – Product produced by electrolysis involving electrolytic...

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205125, C25D 706, B32B 1520

Patent

active

056792301

ABSTRACT:
A electrolytically deposited copper foil has a roughening treatment of copper on the shiny side and on the matte side a fine nodular metal deposit preferably copper or a copper alloy which improves adhesion to a substrate, but is insufficient to increase the measured surface roughness Rz.

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patent: 5482784 (1996-01-01), Ohara et al.

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