Copper foil for printed circuit boards

Details Copper foil for printed circuit boards Copper foil for printed circuit boards

1995-08-21

1997-10-21

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Product produced by electrolysis involving electrolytic...

205125, C25D 706, B32B 1520

Patent

active

056792301

ABSTRACT:
A electrolytically deposited copper foil has a roughening treatment of copper on the shiny side and on the matte side a fine nodular metal deposit preferably copper or a copper alloy which improves adhesion to a substrate, but is insufficient to increase the measured surface roughness Rz.

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patent: 4997516 (1991-03-01), Adler
patent: 5057193 (1991-10-01), Lin et al.
patent: 5437914 (1995-08-01), Saida et al.
patent: 5482784 (1996-01-01), Ohara et al.

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