Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
2006-09-19
2006-09-19
Lavilla, Michael E. (Department: 1775)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C428S674000, C428S658000, C428S666000, C428S341000, C428S607000, C428S447000, C428S450000
Reexamination Certificate
active
07108923
ABSTRACT:
A copper foil for a printed circuit board has a rust preventing layer formed by a trivalent chromium chemical conversion treatment on a surface of the copper foil that the copper foil is bonded to a base material for the printed circuit board. T copper foil is of copper or copper alloy, and the rust preventing layer contains 0.5 to 2.5 μg/cm2of chromium converted into metallic chromium.
REFERENCES:
patent: 6132589 (2000-10-01), Ameen et al.
patent: 52-145769 (1977-12-01), None
patent: 06-54829 (1994-07-01), None
patent: 3142259 (2000-12-01), None
patent: 2005-008972 (2005-01-01), None
patent: 2005-042139 (2005-02-01), None
patent: WO 97/04627 (1997-02-01), None
Ito Yasuyuki
Kodaira Muneo
Kusano Yasuhiro
Matsumoto Katsuyuki
Nomura Katsumi
Hitachi Cable Ltd.
Lavilla Michael E.
McGinn IP Law Group PLLC
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