Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
2008-03-18
2008-03-18
Lam, Cathy F. (Department: 1794)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C428S209000, C428S615000, C428S626000, C428S658000, C174S257000
Reexamination Certificate
active
11249452
ABSTRACT:
A copper foil1comprises a roughened plating layer2, a Ni—Co alloy plating layer3, a zinc galvanized (underlying) layer4, a chromate treatment layer5, and a silane coupling treatment layer6on a surface to be bonded with a base material for a printed circuit board, and the chromate treatment layer5is formed by using a trivalent chromium conversion treatment solution containing 70 mg/L or more and less than 500 mg/L of trivalent chromium ions converted into metal chromium and having a pH-value of 3.0 to 4.5. According to the present invention, a copper foil for a printed circuit board, a method for fabricating the same, and a trivalent chromium conversion treatment solution used for fabricating the same, which have an excellent controllability in Zn film forming amount and chromate film forming amount can be obtained.
REFERENCES:
patent: 4387006 (1983-06-01), Kajiwara et al.
patent: 4801337 (1989-01-01), Higgins
patent: 4966634 (1990-10-01), Saeki et al.
patent: 5022938 (1991-06-01), Wieczerniak
patent: 5230932 (1993-07-01), Chen et al.
patent: 5861076 (1999-01-01), Adlam et al.
patent: 6329074 (2001-12-01), Fujiwara et al.
patent: 6605369 (2003-08-01), Takahashi et al.
patent: 1 558 919 (1980-01-01), None
patent: 52-145769 (1977-12-01), None
patent: 6-54829 (1994-03-01), None
patent: 3142259 (2000-12-01), None
patent: 2005-8972 (2005-01-01), None
patent: 2005-42139 (2005-02-01), None
Ito Yasuyuki
Kodaira Muneo
Nomura Katsumi
Sasaki Gen
Watanabe Shingo
Foley & Lardner LLP
Hitachi Cable Ltd.
Lam Cathy F.
LandOfFree
Copper foil for printed circuit board, method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Copper foil for printed circuit board, method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper foil for printed circuit board, method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3917898