Copper foil for inner layer circuit of multi-layered printed cir

Details Copper foil for inner layer circuit of multi-layered printed cir Copper foil for inner layer circuit of multi-layered printed cir

1991-05-28

1994-06-14

Nelson, Peter A.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

428551, 428552, 428553, 428606, 428607, 428647, 428658, 428666, 428668, 428674, 428675, 428678, 205125, 205152, 205154, 205155, 205156, B22F 704

Patent

active

053209192

ABSTRACT:
A copper foil for an inner layer circuit of a multi-layered printed circuit board, which comprises a black metal plated layer formed on at least the rough surface which becomes a surface of an inner layer circuit of a copper foil having both sides roughened in advance, in order to enhance the bonding strength to a prepreg, make it safe from haloing and facilitate optical checking of the copper foil.

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World Patent Index Latest Week 9119, Mar. 25, 1991, Derwent Publications Ltd., London, GB. AN 91-135474 & JP-A-3 068 795.

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