Copper foil for high frequency circuit, method of production...

Details Copper foil for high frequency circuit, method of production... Copper foil for high frequency circuit, method of production...

2011-07-26

2011-07-26

Zimmerman, John J (Department: 1784)

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

C428S675000, C428S935000, C205S077000, C205S152000, C205S182000

Reexamination Certificate

active

07985485

ABSTRACT:
A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.

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