Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
2006-04-11
2006-04-11
Lam, Cathy F. (Department: 1775)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C428S469000, C428S472100, C428S472200, C428S472300, C428S618000, C428S621000
Reexamination Certificate
active
07026059
ABSTRACT:
The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electroplating layer laminated in this order on the surface of a carrier foil, wherein a surface of the copper electroplating layer is roughened; a copper-clad laminated board comprising the ultra-thin copper foil with a carrier being laminated on a resin substrate; a printed wiring board comprising the copper-clad laminated board on the ultra-thin copper foil of which is formed a wiring pattern; and a multi-layered printed wiring board which comprising a plural number of the above printed wiring board being laminated.
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English language translation of the International Preliminary Examination Report PCT/IPEA/409 in the International Application PCT/JP01/08220 (date of completion of the report: Dec. 18, 2002).
Fukuda Shin
Hoshino Kazuhiro
Nakaoka Tadao
Suzuki Akitoshi
Circuit Foil Japan Co., Ltd.
Frishauf Holtz Goodman & Chick P.C.
Lam Cathy F.
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