Copper foil for high-density ultra-fine printed wiring board

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Reexamination Certificate

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Details

C428S469000, C428S472100, C428S472300, C428S606000, C428S618000, C428S632000, C428S655000, C428S668000, C205S152000, C205S183000, C205S187000, C205S205000, C205S208000

Reexamination Certificate

active

11180181

ABSTRACT:
The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electroplating layer laminated in this order on the surface of a carrier foil, wherein a surface of the copper electroplating layer is roughened; a copper-clad laminated board comprising the ultra-thin copper foil with a carrier being laminated on a resin substrate; a printed wiring board comprising the copper-clad laminated board on the ultra-thin copper foil of which is formed a wiring pattern; and a multi-layered printed wiring board which comprising a plural number of the above printed wiring board being laminated.

REFERENCES:
patent: 5071520 (1991-12-01), Lin et al.
patent: 5114543 (1992-05-01), Kajiwara et al.
patent: 5366814 (1994-11-01), Yamanishi et al.
patent: 6346335 (2002-02-01), Chen et al.
patent: 6447929 (2002-09-01), Wang et al.
patent: 0 398 721 (1990-11-01), None
patent: 0 960 725 (1999-12-01), None
patent: 57-20347 (1982-02-01), None
patent: 8-181432 (1996-07-01), None
patent: 2000-331537 (2000-11-01), None

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