Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Reexamination Certificate
2006-05-30
2006-05-30
Lavilla, Michael E. (Department: 1775)
Stock material or miscellaneous articles
All metal or with adjacent metals
Foil or filament smaller than 6 mils
C428S674000, C428S675000, C428S687000, C428S447000
Reexamination Certificate
active
07052779
ABSTRACT:
Copper foil for fine pattern printed circuits having a sufficient bond strength with a resin substrate, eliminating the problems of residual copper, erosion at the bottom portions of the circuit lines, etc. at the time of formation of fine patterns, and superior in heat resistance and electrical characteristics, comprising untreated copper foil roughening treated on its surface, wherein the untreated copper foil before roughening treatment is an electrodeposited copper foil having a surface roughness in terms of 10-point average roughness Rz not more than 2.5 μm and a minimum distance between peaks of rough pyramid of at least 5 μm or having further crystal grains of an average particle size of not more than 2 μm exposed at the surface thereof, and a method of production of the same.
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European Search Report mailed May 19, 2004 for corresponding foreign application No. 04250762.
Furukawa Circuit Foil Co., Ltd.
Lavilla Michael E.
Westerman Hattori Daniels & Adrian LLP
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