Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent
1989-09-07
1990-06-19
Zimmerman, John J.
Stock material or miscellaneous articles
All metal or with adjacent metals
Foil or filament smaller than 6 mils
428626, 428675, 428935, B32B 1508, B32B 1520
Patent
active
049353101
ABSTRACT:
A copper-clad laminated board which comprises a resin substrate and a copper foil laminated on said substrate, said copper foil having a resin substrate bonding surface coated completely with a layer consisting essentially of a phosphorus-containing nickel layer formed by electrodeposition, said substrate being in face-to-face contact with said bonding surface of said copper foil.
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Furukawa Circuit Foil Co., Ltd.
Zimmerman John J.
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