Copper foil for a printed circuit and a method for the productio

Details Copper foil for a printed circuit and a method for the productio Copper foil for a printed circuit and a method for the productio

1980-10-31

1983-05-31

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

428674, 204 43Z, C25D 356

Patent

active

043861393

ABSTRACT:
Copper foil for a printed circuit, which comprises a copper layer and a vanadium-containing zinc layer formed on one side or each side of said copper layer, and a method for producing the copper foil. The bonding surface preferably contains a chromate surface.

REFERENCES:
patent: 3585010 (1971-06-01), Luce
patent: 3857681 (1974-12-01), Yates
patent: 3954420 (1976-05-01), Hyner
patent: 3998601 (1976-12-01), Yates
patent: 4088544 (1978-05-01), Hutkin
patent: 4229267 (1980-10-01), Steinecker
patent: 4234395 (1980-11-01), Berdan
patent: 4251329 (1981-02-01), Asuno
patent: 4293617 (1981-10-01), Nagy
Chemical Abstracts, Abstract No. 77:38154f, Sebisty, J. J., "Elevated-Temperature Peeling Failure of Galvanized Coatings", 1977.

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