Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent
1983-03-18
1984-11-20
Rutledge, L. Dewayne
Stock material or miscellaneous articles
All metal or with adjacent metals
Foil or filament smaller than 6 mils
428632, 428675, 428926, 428935, C25D 706, C25D 548, B32B 1501
Patent
active
044839065
ABSTRACT:
Copper foil for printed circuits which comprises a copper layer and a nickel layer formed on one or both sides of said copper layer, the surface of said nickel layer having been subjected to a cathodic chromic acid treatment, and a method for producing the same. Said copper foil can be etched easily and completely with ammonium persulfate solution or with a cupric chloride solution, and is free from so called undercutting phenomenon. A further advantage of printed circuits prepared with said copper foil is that the exposed resin substrate is not stained and the copper foil is strongly adhered to the substrate before and after heating.
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Furukawa Circuit Foil Co., Ltd.
Rutledge L. Dewayne
Zimmerman John J.
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