Copper foil for a printed circuit and a method for the productio

Details Copper foil for a printed circuit and a method for the productio Copper foil for a printed circuit and a method for the productio

1980-10-22

1983-03-08

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

428647, 428646, 428674, 428658, 204 43Z, 204 43S, C25D 330, C25D 322

Patent

active

043761542

ABSTRACT:
A copper foil for a printed circuit comprising a copper layer having the bonding surface coated with a tin layer and having said tin layer coated with a vanadium-containing zinc layer which optionally may be given a chromic acid treatment. The invention also provides a method for producing said copper foil.

REFERENCES:
patent: 3857681 (1974-12-01), Yates
patent: 4049481 (1977-09-01), Morisaki
patent: 4082591 (1978-04-01), Morisaki
patent: 4251329 (1981-02-01), Asano
Chemical Abstracts, Abstract No. 77:38154f, Sebisty, J. J.; "Elevated Temperature Peeling Failure of Galvanized Coatings", 1977.
Metal Industry, vol. 37, "Alkaline Tin Plating Bath", Heiman, S. et al., Apr. 1939, pp. 161-164.

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