Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Reexamination Certificate
2005-06-07
2005-06-07
Lam, Cathy F. (Department: 1775)
Stock material or miscellaneous articles
All metal or with adjacent metals
Having metal particles
C428S336000, C428S352000, C428S607000, C428S615000, C428S637000, C428S647000, C428S675000, C428S680000
Reexamination Certificate
active
06902824
ABSTRACT:
This invention provides a metal foil and an etching process which overcomes the problem of etching of the copper foil layer and the plating copper layer formed on a metal clad laminate during the conventional semi-additive process for producing printed wire boards. In the present invention, the metal foil and the metal foil with carrier foil include a nickel or tin layer 0.5 to 3 μm thick formed on the external surface of a metal clad laminate which protects the surface of the plated layer during the final flash etching of the copper foil layer.
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Hirasawa Yutaka
Kataoka Takashi
Takahashi Naotomi
Yamamoto Takuya
Lam Cathy F.
Mitsui Mining & Smelting Co. Ltd.
Rothwell Figg Ernst & Manbeck P.C.
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