Copper filled conductive epoxy

Details Copper filled conductive epoxy Copper filled conductive epoxy

1974-06-21

1976-09-28

Padgett, Benjamin R.

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

252503, 252512, 260 37M, 260 37EP, 134 2, 134 26, 134 28, H01B 102, H01B 106

Patent

active

039830756

ABSTRACT:
An electrically conductive resinous composition of a copper flake, the surface of which has been cleaned by removing therefrom impurities and/or oxides, a resinous binder, an amount of copper flake in said resinous composition being from 25 to 70 percent, the impurities in said copper flake being less than 7000 ppm, said resinous composition being cured with a curative comprising a polyamide or an anhydride, or mixtures thereof; these compositions are suitable for uses such as heating panels or conformable heating shapes.

REFERENCES:
patent: 2795680 (1957-06-01), Peck
patent: 3345225 (1967-10-01), Lacal
patent: 3686139 (1972-08-01), Lubin

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