Copper-exuding boroaluminosilicate glasses

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428432, 428698, 428901, H05K 103

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active

048987670

ABSTRACT:
There is disclosed a family of low dielectric, copper-exuding, boroaluminosilicate glasses particularly adapted to use in forming substrates for electronic devices such as integrated circuits. The glasses are capable of exuding copper oxide, have a coefficient of thermal expansion of 30-35.times.10.sup.-7 at 300.degree. C., a dielectric constant not over 5.0 at 100 KHz, a loss tangent not over 0.003 at 100 KHz and consist essentially, in percent by weight, of 56-64% SiO.sub.2 18-25% B.sub.2 O.sub.3, 3-11% Al.sub.2 O.sub.3, 0-2% CaO, 0-2% Li.sub.2 O, 0-1% K.sub.2 O, the Li.sub.2 O+K.sub.2 O+CaO being 1.5-3% and 1-20% CuO.

REFERENCES:
patent: 4672152 (1987-06-01), Shinohara et al.
patent: 4732798 (1988-03-01), Ishida et al.
patent: 4752521 (1988-06-01), Smith III et al.

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