Copper-exuding, boroaluminosilicate glasses

Compositions: ceramic – Ceramic compositions – Glass compositions – compositions containing glass other than...

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C03C 3091

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047881658

ABSTRACT:
There is disclosed a family of low dielectric, copper-exuding, boroaluminosilicate glasses particularly adapted to use in forming substrates for electronic devices such as integrated circuits. The glasses are capable of exuding copper oxide, have a coefficient of thermal expansion of 30-35.times.10.sup.-7 at 300.degree. C., a dielectric constant not over 5.0 at 100 KHz, a loss tangent not over 0.003 at 100 KHz and consist essentially, in percent by weight, of 56-64% SiO.sub.2, 18-25% B.sub.2 O.sub.3, 3-11% Al.sub.2 O.sub.3, 0-2% CaO, 0-2% Li.sub.2 O, 0-1% K.sub.2 O, the Li.sub.2 O+CaO being 1.5-3% and 1-20% CuO.

REFERENCES:
patent: 2685526 (1954-08-01), Lebino
patent: 2733158 (1956-01-01), Tiede
patent: 3440172 (1969-04-01), Albinak et al.
patent: 3451579 (1969-06-01), Bishop
patent: 3459569 (1969-08-01), Ellis
patent: 3468646 (1969-09-01), Finn et al.

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