Copper etching compositions and method for etching copper

Details Copper etching compositions and method for etching copper Copper etching compositions and method for etching copper

1999-03-01

2000-07-11

Powell, William

Etching a substrate: processes

Nongaseous phase etching of substrate

Recycling, regenerating, or rejunevating etchant

216 13, 216 20, 216 34, 216105, 252 792, 252 794, C23F 100

Patent

active

060867795

ABSTRACT:
This invention relates to an aqueous etching composition for etching metallic copper comprising

REFERENCES:
patent: 3650957 (1972-03-01), Shipley et al.
patent: 4280887 (1981-07-01), Konstantouros
patent: 4395302 (1983-07-01), Courduvelis
patent: 4466859 (1984-08-01), Nelson
patent: 4525240 (1985-06-01), Elias et al.
patent: 4545877 (1985-10-01), Hillis
patent: 4636282 (1987-01-01), Wong
patent: 5279641 (1994-01-01), Narisawa et al.
patent: 5358602 (1994-10-01), Sutcliffe et al.
patent: 5554211 (1996-09-01), Bokisa et al.
patent: 5620612 (1997-04-01), Kukanskis et al.
patent: 5747098 (1998-05-01), Larson

Affiliated with

Also associated with

Rating

Copper etching compositions and method for etching copper does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper etching compositions and method for etching copper, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper etching compositions and method for etching copper will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-538566