Copper etching

Details Copper etching Copper etching

1994-07-19

1995-07-11

Powell, William

Etching a substrate: processes

Gas phase and nongaseous phase etching on the same substrate

252 791, 216 65, 216 67, 216107, B44C 122, C23F 100

Patent

active

054317746

ABSTRACT:
A dry etch for metals such as copper using .pi.-acids in an energetic environment such as a plasma, laser, or afterglow reactor (102) or by using ligands forming volatiles at low temperature within a pulsed energetic environment.

REFERENCES:
patent: 4490211 (1984-12-01), Chen et al.
patent: 5085731 (1992-02-01), Norman et al.
patent: 5098516 (1992-03-01), Norman et al.

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