Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate
Patent
1993-09-08
1995-07-11
Breneman, R. Bruce
Etching a substrate: processes
Nongaseous phase etching of substrate
Etching inorganic substrate
437245, 437228, 216 13, B44C 122
Patent
active
054317762
ABSTRACT:
Copper etchant solution additives for use with an aqueous alkaline ammoniacal cupric chloride etching bath include several compounds, each of which is shown to stabilize the copper(I) state. The compounds discovered by the present invention include iodide ions such as potassium iodide, ammonium iodide, sodium iodide, calcium iodide and magnesium iodide. Other copper(I) stabilizers discovered by the present invention include certain water soluble salts containing sulfur such as a thiocyanate ion (e.g. ammonium thiocyanate, potassium thiocyanate, sodium thiocyanate, magnesium thiocyanate, and calcium thiocyanate) and a thiosulfate ion (e.g. ammonium thiosulfate, potassium thiosulfate, sodium thiosulfate, magnesium thiosulfate, and calcium thiosulfate). Etching rates for alkaline ammoniacal cupric chloride with different concentrations of potassium iodide, ammonium thiocyanate, and sodium thiosulfate were studied. The results of controlled experiments revealed that adding concentrations up to approximately 1200 mg/L of any one of these compounds to the alkaline ammoniacal cupric chloride etchant resulted in a 20-130% increase in etch rate.
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Hawley's Condensed Chemical Dictionary, 12th Edition, Van Nostrand Reinhold Company, 1993, p. 1146.
Jordan Charles F.
Richardson Hugh W.
Breneman R. Bruce
Chang Joni Y.
Gordon David P.
Phibro-Tech Inc.
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