Copper etchant solution additives

Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate

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Details

437245, 437228, 216 13, B44C 122

Patent

active

054317762

ABSTRACT:
Copper etchant solution additives for use with an aqueous alkaline ammoniacal cupric chloride etching bath include several compounds, each of which is shown to stabilize the copper(I) state. The compounds discovered by the present invention include iodide ions such as potassium iodide, ammonium iodide, sodium iodide, calcium iodide and magnesium iodide. Other copper(I) stabilizers discovered by the present invention include certain water soluble salts containing sulfur such as a thiocyanate ion (e.g. ammonium thiocyanate, potassium thiocyanate, sodium thiocyanate, magnesium thiocyanate, and calcium thiocyanate) and a thiosulfate ion (e.g. ammonium thiosulfate, potassium thiosulfate, sodium thiosulfate, magnesium thiosulfate, and calcium thiosulfate). Etching rates for alkaline ammoniacal cupric chloride with different concentrations of potassium iodide, ammonium thiocyanate, and sodium thiosulfate were studied. The results of controlled experiments revealed that adding concentrations up to approximately 1200 mg/L of any one of these compounds to the alkaline ammoniacal cupric chloride etchant resulted in a 20-130% increase in etch rate.

REFERENCES:
patent: 4311551 (1982-01-01), Sykes
patent: 4319955 (1982-03-01), Murski
patent: 4784551 (1988-11-01), Cordani et al.
patent: 4859281 (1989-08-01), Goltz
patent: 4892776 (1990-01-01), Rice
patent: 5043244 (1991-08-01), Cairncross
patent: 5085730 (1992-02-01), Cordani
patent: 5243320 (1993-09-01), Clouser
patent: 5248398 (1993-09-01), Cordani
Hawley's Condensed Chemical Dictionary, 12th Edition, Van Nostrand Reinhold Company, 1993, p. 1146.

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