Copper etchant compositions

Details Copper etchant compositions Copper etchant compositions

1987-12-29

1988-11-15

Andrews, R. L.

Compositions

Etching or brightening compositions

Inorganic acid containing

20412975, C09R 1302

Patent

active

047847859

ABSTRACT:
The etching rate of an alkaline ammonium copper etching bath is accelerated by inclusion therein of an etchant accelerating amount of a mixture comprising an ammonium halide, a water-soluble salt containing sulfur, selenium or tellurium in the anion, an organic thio compound containing the group ##STR1## and, optionally, a water-soluble salt of a noble metal (e.g. silver).

REFERENCES:
patent: 2982625 (1961-05-01), Saubestre
patent: 4144119 (1979-03-01), Dutkewych
patent: 4311551 (1982-01-01), Sykes
patent: 4404074 (1983-09-01), Tomaszewshi
patent: 4557811 (1985-12-01), Furst et al.
patent: 4564428 (1986-01-01), Furst et al.

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