Copper/epoxy structures

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174256, H05K 100

Patent

active

051839725

ABSTRACT:
A high density, high performance circuit fabricated with a copper/epoxy structure. The circuit is well suited for an integrated circuit interconnect device. Fluorene-containing epoxy resins may be used to obtain certain material and processing advantages over copper/polyimide structures. The circuit structure resides on a substrate which may be ceramic, a semiconductor such as silicon, or, advantageously, a cured epoxy resin.

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