Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating
Patent
1991-12-05
1993-10-12
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal coating
205125, 205298, 106 126, C25D 338
Patent
active
052521966
ABSTRACT:
Compositions and processes for electrolytic plating. The compositions are characterized by critical amounts of one or more brightening and leveling agents. The compositions are particularly useful for plating through hole walls of printed circuit boards, including through holes having an aspect ratio equal or greater than about ten to one.
REFERENCES:
patent: 3267010 (1966-08-01), Creutz et al.
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3770598 (1973-11-01), Cruetz
patent: 3784454 (1974-01-01), Lyde
patent: 3798138 (1974-03-01), Ostrow et al.
patent: 4336114 (1982-06-01), Mayer et al.
patent: 4347108 (1982-08-01), Willis
patent: 4975159 (1990-12-01), Dahms
patent: 5004525 (1991-04-01), Bernards et al.
patent: 5051154 (1991-09-01), Bernards et al.
patent: 5068013 (1991-11-01), Bernards et al.
Bernards Roger F.
Fisher Gordon
Houle Patrick
Sonnenberg Wade
Bolam Brian M.
Corless Peter F.
Goldberg Robert L.
Niebling John
Shipley Company Inc.
LandOfFree
Copper electroplating solutions and processes does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Copper electroplating solutions and processes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper electroplating solutions and processes will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1901864