Copper electroplating solutions and methods of making and using

Organic compounds -- part of the class 532-570 series – Organic compounds – Compounds having the group -c

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C07C14800

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active

047867469

ABSTRACT:
A method of preparing a compound useful as a brightener in aqueous copper electroplating solutions comprising reacting a compound of the following formula: ##STR1## with a compound of the formula:

REFERENCES:
patent: 2579531 (1951-12-01), Zadra
patent: 2677653 (1954-05-01), Chester et al.
patent: 2758076 (1956-08-01), Passal
patent: 2798040 (1957-07-01), Pye et al.
patent: 2825684 (1958-03-01), Wernlund
patent: 2837472 (1958-06-01), Gundel et al.
patent: 2888390 (1959-05-01), Lapee
patent: 2954331 (1960-09-01), Abbott
patent: 3203878 (1965-08-01), Willmund et al.
patent: 3287236 (1966-11-01), Brugger
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3414493 (1968-12-01), Nobel et al.
patent: 3542655 (1970-11-01), Kardos et al.
patent: 3682788 (1972-08-01), Kardos et al.
patent: 3743584 (1973-07-01), Todt et al.
patent: 3748237 (1973-07-01), Creutz
patent: 3764660 (1972-07-01), Lyde
patent: 3770598 (1973-11-01), Creutz
patent: 3781296 (1973-12-01), Greco et al.
patent: 3804729 (1974-04-01), Kardos et al.
patent: 3884884 (1975-05-01), Scoggins et al.
patent: 3904686 (1975-09-01), Arnold et al.
patent: 3919179 (1976-11-01), Maxey
patent: 3928365 (1975-12-01), Greco et al.
patent: 3932346 (1976-01-01), Pasternack et al.
patent: 3956235 (1976-05-01), Pasternack et al.
patent: 4038161 (1977-07-01), Eckles et al.
patent: 4110176 (1978-08-01), Creutz et al.
patent: 4128539 (1978-12-01), Onizawa
patent: 4134803 (1979-01-01), Eckles et al.
patent: 4146689 (1979-03-01), Onizawa
patent: 4165416 (1979-08-01), Matoba et al.
patent: 4177337 (1979-12-01), Onizawa
patent: 4181582 (1980-01-01), Dahms
patent: 4272335 (1981-06-01), Combs
patent: 4278510 (1981-07-01), Chien et al.
patent: 4289861 (1981-09-01), Onizawa
patent: 4347108 (1982-08-01), Willis
patent: 4376685 (1983-03-01), Watson
patent: 4384930 (1983-05-01), Eckles
patent: 4399075 (1983-08-01), Yoshida et al.
patent: 4490220 (1984-12-01), Houman
patent: 4502927 (1985-03-01), Barclay et al.
patent: 4514442 (1985-04-01), Crepeau
patent: 4555315 (1985-11-01), Barbieri et al.
patent: 4587140 (1986-05-01), Johnson et al.
patent: 4601847 (1986-07-01), Barber, Jr.
patent: 4663237 (1987-05-01), Johnson et al.
patent: 4666785 (1987-05-01), Crepeau
Bulletin of Howard Hall International, "Electroplating Chemicals", Feb. 1985.

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