Copper electroplating solutions and methods

Details Copper electroplating solutions and methods Copper electroplating solutions and methods

1989-08-28

1990-08-14

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 338

Patent

active

049484745

ABSTRACT:
A method of preparing a compound useful as a brightener in aqueous copper electroplating solutions comprising reacting a compound of the following formula: ##STR1## with a compound of the formula:

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Bulletin of Howard Hall International, "Electroplating Chemicals", Feb. 1985.

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