Copper electroplating process

Details Copper electroplating process Copper electroplating process

1982-08-11

1984-09-04

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 52R, 204252, C25D 338, C25D 700

Patent

active

044695640

ABSTRACT:
A copper electroplating process is described in which the anode is surrounded by a cation-permeable membrane so as to prevent decomposition of additives in the electrochemical bath. Such a feature adds to bath lifetime and permits better control of bath chemistry and plating quality during the electroplating process. The feature is especially advantageous for copper electroplating processes using nonconsumable electrodes because of the high consumption of additives and that the copper can be added to the cathode side of the membrane so that acid copper ions need not pass through the membrane.

REFERENCES:
patent: 2707166 (1955-04-01), Brown et al.
patent: 3124520 (1964-03-01), Juda
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3537961 (1970-11-01), White et al.
patent: 4073708 (1978-02-01), Hicks
patent: 4269670 (1981-05-01), Smith
patent: 4310391 (1982-01-01), Okinaka et al.
Proceedings of the 8th Congress of the International Union for Electrodeposition and Surface Finishing, "Function and Structure of Organic Additives in Electroplating", H. Brown, pp. 114-121, 1973.
Plating and Surface Finishing, vol. 68, pp. 46-49, 1981, "Characteristics of Acid Copper Sulfate Deposits for Printed Wiring Board Applications", L. Mayer and S. Barbieri.
Encyclopedia of Electrochemistry, pp. 726-735, 1964.

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