Copper electroplating procedure

Chemistry: electrical and wave energy – Processes and products

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204 52R, 204231, C25D 502, C25D 338, C25D 1700

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active

044459807

ABSTRACT:
In traditional copper electroplating processes, soluble copper anodes are used as the source of copper. There are certain potential advantages to using nonconsumable anodes and adding a source of copper such as copper oxide to replenish the electroplating bath. Periodic reverse current plating is used by some manufacturers to obtain smoother deposits without the use of additives. This periodic reversal of current drastically reduces the service life of the nonconsumable anodes because of dissolution of the metal oxide on the insoluble anode. The invention is a copper electroplating process with a dual-element anode assembly. This assembly consists of electrically isolated copper and metal-oxide electrodes. The metal-oxide electrode is active only during the anodic part of the cycle while the copper electrode is active only during the cathodic part of the cycle. Electrical isolation is achieved by the use of diodes or relays.

REFERENCES:
patent: 1465034 (1923-08-01), Antisell
patent: 1534709 (1925-04-01), Holt
patent: 3573193 (1971-03-01), Powers
patent: 4269670 (1981-05-01), Smith
patent: 4310391 (1982-01-01), Okinaka et al.
"The Application of Pulsed Plating Techniques to Metal Deposition", Plating, 61, C. C. Wan et al., 1974, p. 559.
"Periodic Reverse Current Process in Electroplating Using Acid Copper Electrolytes", Transactions of the Institute of Metal Finishing, 56, J. Mann, 1978, pp. 70-74.
"PR Copper Cyanide Plating of Printed Wiring Boards", Plating, 59, H. L. Pinkerton et al., 1972, pp. 672-676.

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