Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly single metal or alloy substrate of...
Reexamination Certificate
2006-12-26
2006-12-26
King, Roy (Department: 1742)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating predominantly single metal or alloy substrate of...
C205S296000
Reexamination Certificate
active
07153408
ABSTRACT:
The present invention is directed to an improved copper plating bath for depositing a copper layer onto a printing cylinder, the copper plating bath comprising: (a) a source of copper ions; (b) a source of methane sulphonate ions; (c) a source of chloride ions; (d) an organosulphur compound having the formula R—S—R′—SO3−X+or X+—O3S—R′—S—R—S—R′—SO3—X+, wherein R is alkyl, hydroxyalkyl or alkyl ether, R′ is a C2–C4alkyl group, and X+is a cation; and (e) a polyether compound and method of using the same. The copper plating bath produces a plating deposit that has a stable hardness and is free from self-annealing during high speed plating.
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Herdman Roderick D.
Pearson Trevor
Carmody & Torrance LLP
King Roy
Leader William T.
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