Copper electroplating method and apparatus

Details Copper electroplating method and apparatus Copper electroplating method and apparatus

2005-05-10

2005-05-10

Valentine, Donald R. (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C205S291000, C205S296000

Reexamination Certificate

active

06890416

ABSTRACT:
An electroplating apparatus prevents anode-mediated degradation of electrolyte additives by creating a mechanism for maintaining separate anolyte and catholyte and preventing mixing thereof within a plating chamber. The separation is accomplished by interposing a porous chemical transport barrier between the anode and cathode. The transport barrier limits the chemical transport (via diffusion and/or convection) of all species but allows migration of ionic species (and hence passage of current) during application of sufficiently large electric fields within electrolyte.

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Fang, et al., “Uniform Copper Electroplating on Resistive Substrates,” Abs. 167, 205thMeeting, © 2004 The Electrochemical Society, Inc., 1 page.

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