Copper electrolytic solution containing organic sulfur...

Details Copper electrolytic solution containing organic sulfur... Copper electrolytic solution containing organic sulfur...

2006-12-05

2006-12-05

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C106S001260

Reexamination Certificate

active

07144491

ABSTRACT:
It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly to obtain an electrolytic copper foil which allows fine patterning, and which is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. Furthermore, it is an object of the present invention to obtain a copper electrolytic solution for this purpose. This copper electrolytic solution contains as additives an organo-sulfur compound and a quaternary amine compound with a specific skeleton.

REFERENCES:
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patent: 4384930 (1983-05-01), Eckles
patent: 4490220 (1984-12-01), Houman
patent: 6800188 (2004-10-01), Hagiwara et al.
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patent: 08-053789 (1996-02-01), None
patent: 2002-508452 (2002-03-01), None
patent: WO 99/31300 (1999-06-01), None

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