Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating
Reexamination Certificate
2005-12-09
2010-11-02
Wong, Edna (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal coating
C205S297000, C205S298000
Reexamination Certificate
active
07824534
ABSTRACT:
The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum and, particularly, to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution contains, as an additive, a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups:wherein A is an epoxy compound residue and n is an integer of 1 or more.
REFERENCES:
patent: 3264216 (1966-08-01), Rockett
patent: 4376685 (1983-03-01), Watson
patent: 2004/0149583 (2004-08-01), Kumagai et al.
patent: 2006/0166032 (2006-07-01), Kumagai et al.
patent: 63-310989 (1988-12-01), None
patent: 08-156176 (1996-06-01), None
patent: 10-193505 (1998-07-01), None
patent: 10-330983 (1998-12-01), None
patent: 2000-261113 (2000-09-01), None
patent: 2002-506927 (2002-03-01), None
patent: 2002-508452 (2002-03-01), None
patent: 2002-322586 (2002-11-01), None
patent: 2004-107786 (2004-04-01), None
patent: 2004-137588 (2004-05-01), None
patent: 2004-315945 (2004-11-01), None
patent: WO 98/08361 (1998-02-01), None
patent: WO 98/59095 (1998-12-01), None
patent: WO 2004/055246 (2004-07-01), None
Sawyer et al., “Interaction of Anionic Detergents and Certain Polar Aliphatic Compounds in Foams and Micelles”, J. Phys. Chem. (no month, 1958), vol. 62, No. 2, pp. 159-166.
De Almeida et al., “Voltammetric and Morphological Characterization of Copper Electrodeposition from Non-Cyanide Electrolyte”, J. of Appl. Electrochem. (no month, 2002), vol. 32, pp. 763-773.
Japanese language Office Action in a counterpart foreign application dated Jul. 6, 2009 (4 sheets).
Japanese language Office Action in a counterpart foreign application dated May 8, 2009 (4 sheets).
Japanese language Office Action in a counterpart foreign application dated Apr. 9, 2009 (3 sheets).
“Voltammetric and morphological characterization of copper electrodeposition from non-cyanide electrolyte”, M.R.H. De Almeida, et al., Journal of Applied Electrochemistry, vol. 32, pp. 763-773 (2002).
Kobayashi Hironori
Kumagai Masashi
Tsuchida Katsuyuki
Flynn ,Thiel, Boutell & Tanis, P.C.
Nippon Mining & Metals Co., Ltd.
Wong Edna
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