Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
2008-05-27
2008-05-27
Lavilla, Michael E. (Department: 1794)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C428S220000, C428S332000, C428S687000
Reexamination Certificate
active
07378160
ABSTRACT:
The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In particular, the invention has an object of obtaining an electrolytic copper foil that can be finely patterned and have an excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton represented by undermentioned general formula (1) obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction.(In general formula (1), R1 and R2 are each selected from a group consisting of hydroxyalkyl groups, ether groups, aromatic groups, aromatic-substituted alkyl groups, unsaturated hydrocarbon groups, and alkyl groups, A represents an epoxy compound residue, and n represents an integer greater than or equal to 1.)
REFERENCES:
patent: 5834140 (1998-11-01), Wolski et al.
patent: 2003/0106802 (2003-06-01), Hagiwara et al.
patent: 63-310990 (1988-12-01), None
patent: 02-182890 (1990-07-01), None
patent: 08-053789 (1996-02-01), None
patent: 10-330983 (1998-12-01), None
Hanafusa Mikio
Kumagai Masashi
Flynn ,Thiel, Boutell & Tanis, P.C.
Lavilla Michael E.
Nikko Materials Co., Ltd.
LandOfFree
Copper electrolytic solution containing amine compound... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Copper electrolytic solution containing amine compound..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper electrolytic solution containing amine compound... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2816137