Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1998-08-26
2000-10-03
Talbot, Brain K.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 98, 438648, 438656, 438688, 438903, 438945, 438976, B05D 512, H01L 214763
Patent
active
061269891
ABSTRACT:
A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.
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Robinson Karl
Taylor Ted
Micro)n Technology, Inc.
Talbot Brain K.
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