Copper electrodeposition in microelectronics

Details Copper electrodeposition in microelectronics Copper electrodeposition in microelectronics

2011-08-23

2011-08-23

Wong, Edna (Department: 1759)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C205S118000, C205S123000, C205S125000, C205S298000

Reexamination Certificate

active

08002962

ABSTRACT:
A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a substituted pyridyl polymer compound for leveling.

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