Copper doping of eutectic solder

Details Copper doping of eutectic solder Copper doping of eutectic solder

1990-02-16

1990-07-03

Rosenberg, Peter D.

Alloys or metallic compositions

Tin base

Lead containing

148 24, C22C 1300, B23K 3534

Patent

active

049389246

ABSTRACT:
Eutectic solder, including a combination of tin, lead and silver is doped by the addition of copper to substantially improve its effectiveness in soldering printed wiring cards which have been screen printed with conductors and mounting pads for components, with a low temperature, thick film cermet copper conductor. The addition of the copper substantially improves wetting and increases long term solder joint reliability.

REFERENCES:
patent: 4070192 (1978-01-01), Arbib

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