Copper device and use thereof with semiconductor devices

Details Copper device and use thereof with semiconductor devices Copper device and use thereof with semiconductor devices

1990-04-04

1991-07-09

Jackson, Jr., Jerome

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 81, 357 71, 165905, 165865, H01L 3902, H01L 2348

Patent

active

050310291

ABSTRACT:
A device that contains a copper substrate; a rigidizing layer and/or a metal layer, and a non-graphitic hard carbon layer deposited on the rigidizing layer; and use as a heat sink or piston for electronic components.

REFERENCES:
patent: 4647494 (1987-03-01), Meyerson et al.
patent: 4665415 (1987-05-01), Esaki et al.
patent: 4728626 (1988-03-01), Tu
patent: 4770242 (1988-09-01), Duikaku et al.
patent: 4809044 (1989-02-01), Pryor et al.
patent: 4819037 (1989-04-01), Sakakibara et al.
patent: 4849856 (1989-07-01), Funari et al.
Yea, "Bump Internal-Thermal Enhancement", IBM Technical Disclosure Bulletin, vol. 27, No. 7B, Dec. 1984, pp. 4413-4415.
Meyerson et al., Electrical and Optical Properties of Hydrogenated Amorphous Carbon Films, Journal of Non-Crystalline Solids, 35 & 36 (1980) pp. 435-440, North-Holland Publishing Company.

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