Copper deposition from electroless plating bath

Details Copper deposition from electroless plating bath Copper deposition from electroless plating bath

1987-01-20

1990-02-27

Beck, Shrive

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

427304, 427305, B05D 118

Patent

active

049045067

ABSTRACT:
Copper is deposited onto a substrate by plating a first layer of copper onto the substrate from an electroless plating bath and plating a second layer of copper onto the first layer of copper from a second and different electroless plating bath. The first and second plating baths differ from each other in at least the cyanide content. The process reduces plating void defects and reduces nodule formation.

REFERENCES:
patent: 2938805 (1960-05-01), Agens
patent: 2996403 (1961-08-01), Lukes
patent: 3844799 (1974-10-01), Underkofler et al.
patent: 3900599 (1975-08-01), Feldstein
patent: 4152467 (1979-05-01), Alpaugh et al.
patent: 4525390 (1985-06-01), Alpaugh
patent: 4552787 (1985-11-01), Chebinish

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