Copper crystal film coated organic substrate

Stock material or miscellaneous articles – Composite – Of metal

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20419214, 20419211, 427250, 427533, 428141, 428458, 4284735, 428901, B32B 1508, B32B 1520, B05D 306

Patent

active

055019110

ABSTRACT:
A copper film coated substrate includes a substrate and a copper film formed on a surface of the substrate. The copper film has an X-ray diffraction intensity of 2.0 cps
m or more per unit film thickness at a crystal orientation (111) face of the copper film. A crystal orientation of a copper thin film is controlled by irradiating a surface of a substrate with inert gas ions before forming a copper thin film on the substrate by a physical vapor deposition process. A copper thin film is formed by irradiating a surface of a substrate with ions, and depositing a copper thin film on the irradiated substrate. In the ion irradiating step, an ion irradiation energy for a dosage of the irradiated ions is controlled, so that crystal is greatly grown to be orientated in a direction of copper (111) face with a less dosage of the irradiated ions.

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patent: 4975327 (1990-12-01), Somasiri et al.
patent: 5087476 (1992-02-01), Tohma et al.
patent: 5089347 (1992-02-01), Hart
EPO Search Report.
"Formation of Copper Thin Film by a Low Kinetic Energy Particle Process", Tadahiro Ohmi, 1046 Journal of the Electrochemical Society 138 (1991) Apr., No. 4, Manchester, NH, US.

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