Copper conductor compositions

Compositions – Electrically conductive or emissive compositions – Free metal containing

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Details

75252, 75255, 106 113, 106 115, 252514, 252515, 252518, 252519, H01B 102

Patent

active

046875972

ABSTRACT:
A fritless copper conductor composition suitable for overprinting on copper consisting essentially of (a) 10-50% wt. finely divided copper particles, (b) 90-50% wt. coarse copper particles, (c) 0.2-2% wt. reducible heavy metal oxide, (d) 0-1.0% refractory metal and (e) 0-5.0% of a high surface area noble metal, all the particles being dispersed in an organic medium.

REFERENCES:
patent: 3794518 (1974-02-01), Howell
patent: 3957453 (1976-05-01), Hassler et al.
patent: 4323483 (1982-04-01), Rellick
patent: 4514321 (1985-04-01), Siuta
patent: 4521329 (1985-06-01), Siuta et al.

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